This book comprehensively and deeply introduces the semiconductor device principle and technology. The book consists of three sections: semiconductor physics and devices, semiconductor manufacturing process and semiconductor device packaging and testing. The first section mainly introduces semiconductor physics foundation, diode, bipolar transistor, MOS field effect transistor, power MOSFET, thyristor, IGBT, passive device and SPICE model. The second section mainly introduces semiconductor process technology, semiconductor process simulation and thin film preparation technology. The third section mainly introduces semiconductor packaging, testing and simulating technology. These contents will lay a solid foundation for further mastering the basic theories and methods of analysis, design, manufacturing, packaging and testing of semiconductor devices.
This book can be used as a textbook for undergraduate and graduate students who are engaged in the analysis, design, manufacturing, packaging, testing and simulating of semiconductor devices and IC design. It can also be used as a self-study and reference book for professional engineers.
本書全面、深入地介紹了半導(dǎo)體器件的原理和技術(shù)。本書包括三個部分:半導(dǎo)體物理和器件，半導(dǎo)體制造過程和半導(dǎo)體器件包裝和測試。第一部分主要介紹半導(dǎo)體物理基礎(chǔ)、二極管、雙極晶體管、MOS場效應(yīng)晶體管、功率MOSFET、晶閘管、IGBT、無源器件和SPICE模型。第二部分主要介紹半導(dǎo)體工藝技術(shù)、半導(dǎo)體工藝模擬和薄膜制備技術(shù)。第三部分主要介紹半導(dǎo)體封裝、測試與模擬技術(shù)。這些內(nèi)容將為進一步掌握半導(dǎo)體器件的分析、設(shè)計、制造、封裝和測試的基本理論和方法奠定堅實的基礎(chǔ)。

本書可作為從事半導(dǎo)體器件分析、設(shè)計、制造、封裝、測試、模擬和集成電路設(shè)計的本科和研究生教材，也可作為專業(yè)工程師的自學(xué)和參考書。