The technical level and development scale of the integrated circuit (IC) industry is one of the important indicators to measure a countrys industrial competitiveness and comprehensive national strength, and is the source of modern economic development. The application of IC has already become routine in arious industries, such as military satellites, radar, civilian automotive electronics, smart equipment, and consumer electronics, etc. At present, the IC industry has formed three major industrial chains of design, manufacturing and packaging testing, which have become the indispensable pillar in the IC industry.

IC packaging is an indispensable process in the IC industry, which is the bridge from chip to device and device to system. It is a key fundamental manufacturing part of the IC industry and a competitive commanding height for the core device manufacturing of the IC industry.

With the rapid development of IC technology, higher and higher requirements for miniaturization, multi-function, high reliability and low cost of electronic products are put forward. Facing this situation, the electronic packaging materials and technologies are undergoing rapid development, promoting lots of advanced packaging materials. Advanced electronic packaging materials and technologies are the core of IC packaging.

In order to promote the development of Chinas advanced electronic packaging industry and meet the urgent needs of researchers ranged from teaching and scientific study to engineering developing in the field of electronic packaging, the editorial committee has invited famous specialists to write the Series on Advanced Electronic Packaging Technology and Key Materials in recent years (English version). The series includes: Advanced Polyimide Materials From LED to Solid State Lighting Freeform Optics for LED Packages and Applications Modeling, Analysis, Design and Tests for Electronics Packaging beyond Moore TSV(through-silicon via technology) Package etc.

This series of books systematically describes the advanced electronic packaging from three aspects: advanced packaging materials, advanced packaging technologies and advanced packaging simulation design methods. This series covers the most advanced packaging materials such as polyimide materials and packaging technologies such as freeform optical technology, TSV (through-silicon via technology) packaging, and advanced packaging simulation design methods such as multi-physics analysis and applications. In addition, this series also makes a planning outlook and forecast for the development trend of advanced electronic packaging.

This series of books is of great worth for workers engaged in scientific research, production and application in electronic packaging and related industries, and also has great reference significance for teachers and students of related majors in higher education institutions.

We believe that the publication of this series of books will play a positive role in promoting the development of Chinas IC industry and advanced electronic packaging industry.

Finally, we would like to express our sincere gratitude to our colleagues who have worked hard in the preparation of this series. We also express our heartfelt thanks to those who participated in organizing the publication of this series!



C.P.

IEEE Fellow

Member of Academy of Engineering of the USA

Member of Chinese Academy of Engineering

Former Bell Labs Fellow

Dean of Engineering, The Chinese University of Hong Kong

Regents Professor, Georgia Institute of Technology, Atlanta, GA 30332, USA



Sheng Liu, Ph.D.

IEEE Fellow, ASME Fellow

Chang Jiang Scholar Professor

Dean, School of Power and Mechanical Engineering,

Founding Executive Director, Institute of Technology Sciences

Associate Dean of School of Microelectronics, Wuhan University

Professor of School of Mechanical Science and Engineering

Huazhong University of Science and Technology

Wuhan, Hubei, China



Wenhui Zhu, Ph.D.

National Invited Professor

College of Mechanical and Electrical Engineering,

Central South University

Changsha, Hunan, China